Ceramic substrates for high voltage power electronics: past, present and future

被引：0

作者：

Valdez-Nava, Zarel ^{[1
]}

Kenfaui, Driss ^{[1
]}

Locatelli, Marie-Laure ^{[1
]}

Laudebat, Lionel ^{[1
]}

Guillemet, Sophie ^{[2
]}

机构：

[1] Univ Toulouse, LAPLACE, CNRS, INPT,UPS, F-31062 Toulouse 9, France

[2] Univ Toulouse, CIRIMAT, CNRS, INPT,UPS, F-31062 Toulouse 9, France

来源：

2019 IEEE INTERNATIONAL WORKSHOP ON INTEGRATED POWER PACKAGING (IWIPP) | 2019年

关键词：

Power modules; high voltage packaging; ceramic substrates; field grading strategies; PARTIAL DISCHARGE; TECHNOLOGY; BREAKDOWN;

D O I：

10.1109/iwipp.2019.8799084

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In the present work, we report a review of the ceramic substrate technologies used for high voltage power electronics modules. These technologies will be confronted with the different challenges undertaken to improve the properties of the ceramic substrate, from thermal, mechanical and dielectric performance point of view. We describe some of the current developments on the design of substrate both from the architecture and from the material points of view. In particular, a new strategy on the design and realization of a ceramic substrate based on aluminum nitride is presented.

引用

页码：91 / 96

页数：6

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