Molecular Dynamics Simulation for Epoxy-based Nanocomposites

被引:0
|
作者
Sawa, Fumio [1 ]
Imai, Takahiro [1 ]
机构
[1] Toshiba Co Ltd, Power & Ind Syst R&D Ctr, Tsurumi Ku, 2-4 Suehiro Cho, Yokohama, Kanagawa 2300045, Japan
关键词
thermosetting resin; nanocomposites; coarse grained molecular dynamics; epoxy;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Nanocomposites with nano-filler and thermosetting resins such as epoxy are the promising materials for the insulating materials. To achieve the good properties of nanocomposites, it is important to control the interfaces between nano-filler surface and the matrix resins. To clarify the role of nano scale interface on macroscopic properties, we have conducted a molecular dynamics simulation with using coarse graining method (bead-spring model). We have investigated the molecular motion near the interface between nano-fillers and matrix thermosetting resins. It was observed that the mobility of the molecules of matrix resin close to the nano-filler surfaces is different from the bulk regions.
引用
收藏
页码:327 / 329
页数:3
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