共 50 条
- [1] Preparation and properties of a novel electrically conductive adhesive using a composite of silver nanorods, silver nanoparticles, and modified epoxy resin [J]. Journal of Materials Science: Materials in Electronics, 2012, 23 : 108 - 114
- [3] Dependence of Shear Strength of Adhesive Conductive Joints on Adhesive Modification with the Silver Nanoparticles and Climatic Aging [J]. 2020 IEEE 26TH INTERNATIONAL SYMPOSIUM FOR DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING (SIITME 2020), 2020, : 331 - 334
- [4] Effect of Treated Silver Nanoparticles to Electrical Conductivity Improvement of Electrically Conductive Adhesive (ECA) [J]. ICSE: 2008 IEEE INTERNATIONAL CONFERENCE ON SEMICONDUCTOR ELECTRONICS, PROCEEDINGS, 2008, : 549 - +
- [5] Electrically Conductive Adhesive Filled with Mixture of Silver Nano and Microparticles [J]. ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2008, : 1141 - +
- [8] Study of Modification of Conductive Adhesive by Nanoparticles and Aging of Modified Adhesive [J]. 2019 IEEE 25TH INTERNATIONAL SYMPOSIUM FOR DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING (SIITME 2019), 2019, : 118 - 121
- [10] Mathematical Modeling of Resistance of Conductive Adhesive Joints in Climatic Aging [J]. 2021 IEEE 27TH INTERNATIONAL SYMPOSIUM FOR DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING (SIITME 2021), 2021, : 160 - 164