Sintering of inkjet printed copper nanoparticles for flexible electronics

被引：157
|
作者：
Jang, Seonhee [1 ]
Seo, Youngkwan [1 ]
Choi, Joonrak [1 ]
Kim, Taehoon [1 ]
Cho, Jeongmin [1 ]
Kim, Sungeun [1 ]
Kim, Donghoon [1 ]
机构：
[1] Samsung Electromech Co Ltd, Inkjet Business Grp, Cent R&D Inst, Suwon 443743, Gyunggi Do, South Korea
来源：
SCRIPTA MATERIALIA | 2010年 / 62卷 / 05期
关键词：
Inkjet printing; Sintering; Copper; Nanoparticle; LOW-TEMPERATURE; CU; FILM;
D O I：
10.1016/j.scriptamat.2009.11.011
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
Inkjet printed patterns using copper nanoparticles (NPs) were sintered at 250 degrees C under reducing atmosphere. The size of NPs covered by organic capping molecules was 5 nm on average. A crack-free Cu film was obtained after sintering. The grain size of the film reached 500 nm upon grain growth. However, only agglomeration of NPs was observed at the bottom of the film. The resistance was 0.88 Omega on average and the patterns were electrically tested by light-emitting diodes. (C) 2009 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码：258 / 261
页数：4
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