In-Process Chatter Detection in Surface Grinding

被引:3
|
作者
Tangjitsitcharoen, Somkiat [1 ]
Senjuntichai, Angsumalin [1 ]
机构
[1] Chulalongkorn Univ, Fac Engn, Dept Ind Engn, Phayathai Rd, Bangkok 10330, Thailand
关键词
D O I
10.1051/matecconf/20152802001
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The chatter causes the poor surface finish during the surface grinding. It is therefore necessary to monitor the chatter during the process. Hence, this research has proposed the in-process chatter detection in the surface grinding process by utilizing the dynamic cutting forces. The ratios of the average variances of three dynamic cutting forces have been adopted and applied to identify the chatter during the surface grinding process to eliminate the effects of the cutting conditions. The effects of the cutting conditions on the chatter are also studied and analyzed. The algorithm has been proposed to detect the chatter regardless of the cutting conditions. The verification of the proposed system has been proved through another experiment by using the new cutting conditions. The experimental results have run satisfaction. It is understood that the chatter can be avoided during the in-process surface grinding even though the cutting conditions are changed.
引用
收藏
页数:9
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