Molecular breeding of yeast with higher metal-adsorption capacity by expression of histidine-repeat insertion in the protein anchored to the cell wall

被引：11

作者：

Kambe-Honjoh, H

Ohsumi, K

Shimoi, H

Nakajima, H

Kitamoto, K

机构：

[1] Univ Tokyo, Dept Biotechnol, Bunkyo Ku, Tokyo 1138657, Japan

[2] Natl Res Inst Brewing, Higashihiroshima 7390046, Japan

来源：

JOURNAL OF GENERAL AND APPLIED MICROBIOLOGY | 2000年 / 46卷 / 03期

关键词：

cell surface engineering; CWP1; histidine repeat; metal adsorption; Taka-amylase A;

D O I：

10.2323/jgam.46.113

中图分类号：

Q81 [生物工程学（生物技术）]; Q93 [微生物学];

学科分类号：

071005 ; 0836 ; 090102 ; 100705 ;

摘要：

A fusion protein of hexa-histidine repeat (His) and glycosylphosphatidylinositol (GPI)-anchor region of Saccharomyces cerevisiae Cwp1 with Aspergillus oryzae Taka-amylase A (TAA) was expressed on the yeast cell surface. The expressed fusion protein (TAA-His-Cwp1) was localized on the cell wall and demonstrated amylolytic activity. In comparison with the TAA-Cwp1 expressing strain, these cells exhibited 1.6- to 2.8-fold higher adsorbing capacity for Cu2+, Ni2+, and Zn2+.

引用

页码：113 / 117

页数：5