Fabrication of highly conductive and flexible printed electronics by low temperature sintering reactive silver ink

To solve the problems of high sintering temperatures (similar to 200 degrees C), particle aggregation, nozzle clogging, and poor shelf life of silver nanoparticle inks, we prepared a transparent and stable reactive silver ink for fabricating printed electronics. The ink mainly consisted of ammonia and formic acid ligands, silver acetate, and hydroxyethyl cellulose (HEC) adhesive agent. The highly conducive and flexible silver films were fabricated by printing and low temperature sintering the reactive silver ink, and the effects of sintering temperature and sintering time on the electrical properties of the printed silver films were investigated. Consequently, the printed silver film sintered at 70 degrees C exhibits good electrical properties with a resistivity of 12.1 42 mu Omega.cm, which is only seven times higher than that of bulk silver (1.65 42 mu Omega.cm). Moreover, the silver film also displays excellent adhesive strength and mechanical flexibility in terms of bending and twisting.