A model for resin viscosity during cure in the resin transfer moulding process

被引：92

作者：

Kiuna, N

Lawrence, CJ ^{[1
]}

Fontana, QPV

Lee, PD

Selerland, T

Spelt, PDM

机构：

[1] Univ London Imperial Coll Sci Technol & Med, Dept Chem Engn & Chem Technol, London SW7 2BY, England

[2] British Aerosp PLC, Sowerby Res Ctr, Bristol BS12 7QW, Avon, England

[3] Univ London Imperial Coll Sci Technol & Med, Dept Mat, London SW7 2BY, England

[4] Univ London Imperial Coll Sci Technol & Med, Dept Aeronaut, Ctr Composite Mat, London SW7 2BY, England

来源：

COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING | 2002年 / 33卷 / 11期

基金：

英国工程与自然科学研究理事会;

关键词：

resins; rheological properties; numerical analysis; resin transfer moulding (RTM);

D O I：

10.1016/S1359-835X(02)00177-X

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A cure model has been developed for the viscosity of two-part epoxy/amine resins, focussing on low extents of cure-the most important region for the mould-filling stage in resin transfer moulding. A key advantage of the model is that it is not explicitly dependent on the extent of cure; therefore, the model can be used to predict the viscosity during cure without the need for determining the resin cure kinetics. The model parameters ate obtained from isothermal viscosity-time measurements at constant shear rate. Examples are shown and data are given for five different resins in the temperature range 20-70 degreesC. The model is applied to simulate non-isothermal cure and compared against experimental data. (C) 2002 Elsevier Science Ltd. All rights reserved.

引用

页码：1497 / 1503

页数：7

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