Cascade thermoelectric micro modules for spot cooling high power electronic components

被引：9
|
作者：
Semenyuk, V [1 ]
机构：
[1] Therm Co, Odessa State Acad Refrigerat, UA-65009 Odessa, Ukraine
来源：
XXI INTERNATIONAL CONFERENCE ON THERMOELECTRICS, PROCEEDINGS ICT '02 | 2002年
关键词：
D O I：
10.1109/ICT.2002.1190372
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
The paper represents last achievements in developing short-legged multi-stage thermoelectric coolers (TECs) for spot cooling high power extremely localized electronic and electro-optic elements. Theoretical estimations and experimental study are undertaken to prove the feasibility and high attainable performance of such TECs. Novel multi-stage micro modules with TE legs length down to 0.2 mm having enhanced cooling capacity and increased temperature differences are developed on AIN substrates.
引用
收藏
页码：531 / 534
页数：4
相关论文
共 50 条
  • [1] Thermoelectric micro modules for spot cooling of high density heat sources
    Semenyuk, V
    TWENTIETH INTERNATIONAL CONFERENCE ON THERMOELECTRICS, PROCEEDINGS, 2001, : 391 - 396
  • [2] Comparative investigation of thermoelectric power and cooling modules
    C. Lertsatitthanakorn
    W. Srisuwan
    C. Thanachayanont
    A. Vorasigha
    S. Maneewan
    Experimental Techniques, 2011, 35 : 33 - 36
  • [3] Miniature thermoelectric modules with increased cooling power
    Semenyuk, V.
    ICT'06: XXV INTERNATIONAL CONFERENCE ON THERMOELECTRICS, PROCEEDINGS, 2006, : 322 - 326
  • [4] COMPARATIVE INVESTIGATION OF THERMOELECTRIC POWER AND COOLING MODULES
    Lertsatitthanakorn, C.
    Srisuwan, W.
    Thanachayanont, C.
    Vorasigha, A.
    Maneewan, S.
    EXPERIMENTAL TECHNIQUES, 2011, 35 (01) : 33 - 36
  • [5] Peltier modules in cooling systems for electronic components
    Domke, K.
    Skrzypczak, P.
    ADVANCED COMPUTATIONAL METHODS AND EXPERIMENTS IN HEAT TRANSFER XI, 2010, 68 : 3 - 12
  • [6] Direct liquid cooling of high flux micro and nano electronic components
    Bar-Cohen, Avram
    Arik, Mehmet
    Ohadi, Michael
    PROCEEDINGS OF THE IEEE, 2006, 94 (08) : 1549 - 1570
  • [7] Spray cooling of IGBT electronic power modules
    Mitic, G
    Kiffe, W
    Lefranc, G
    Ramminger, S
    Tilton, DE
    Smetana, BA
    Weir, TD
    THERMAL CHALLENGES IN NEXT GENERATION ELECTRONIC SYSTEMS, 2002, : 147 - 153
  • [8] HOT SPOT COOLING AND HARVESTING CPU WASTE HEAT USING THERMOELECTRIC MODULES
    Lee, Soochan
    Phelan, Patrick E.
    Wu, Carole-Jean
    PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2014, VOL 10, 2015,
  • [9] Design of Thermoelectric Modules for High Heat Flux Cooling
    Ranjan, Ram
    Turney, Joseph E.
    Lents, Charles E.
    Faustino, Virginia H.
    JOURNAL OF ELECTRONIC PACKAGING, 2014, 136 (04)
  • [10] Advances in development of thermoelectric modules for cooling electro-optic components
    Semenyuk, VA
    TWENTY-SECOND INTERNATIONAL CONFERENCE ON THERMOELECTRICS, PROCEEDINGS ICT '03, 2003, : 631 - 636
12345