Time domain analysis of a printed circuit board via

被引：0

作者：

LaMeres, BJ ^{[1
]}

Kalkur, TS

机构：

[1] Agilent Technol, Colorado Springs, CO USA

[2] Univ Colorado, Dept Elect & Comp Engn, Colorado Springs, CO 80933 USA

来源：

MICROWAVE JOURNAL | 2000年 / 43卷 / 11期

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This article describes the time domain analysis of a printed circuit board via connecting two semi-infinitely-long microstrip transmission, lines above a ground plane. An equivalent circuit consisting of capacitance and inductance is given, Time domain reflectometry measurements are taken on an experimental printed circuit board containing vias of various geometries. The responses of the test vias are measured as the radii of the pad cylinder and ground plane clearance are swept, The empirical data are then compared to previously taken simulation data and the differences are discussed.

引用

页码：76 / +

页数：5

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