Microstructure evolution during dewetting in thin Au films

被引：101
|
作者：
Mueller, Claudia Manuela [1 ]
Spolenak, Ralph [1 ]
机构：
[1] ETH, Lab Nanomet, Dept Mat, CH-8093 Zurich, Switzerland
来源：
ACTA MATERIALIA | 2010年 / 58卷 / 18期
关键词：
Thin films; Annealing; Electron backscatter diffraction; Texture; Wetting; CAPILLARY INSTABILITIES; AGGLOMERATION; TEMPERATURE; STABILITY; MODEL;
D O I：
10.1016/j.actamat.2010.07.021
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Thin metal films can degrade into particles in a process known as dewetting Dewetting proceeds in several stages, including void initiation, void growth and void coalescence. Branched void growth in thin Au films was studied by means of electron backscatter diffraction (EBSD) The holes were found to protrude into the film predominantly at high angle grain boundaries and the branched shape of the holes can be explained by surface energy minimization of the grains at the void boundaries. (111) Texture sharpening during dewetting was observed and quantified by EBSD and in situ X-ray studies (C) 2010 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved
引用
收藏
页码：6035 / 6045
页数：11
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