3-D thermal modelling applied to stress-induced anisotropy of thermal conductivity

被引：14

作者：

Pron, H ^{[1
]}

Bissieux, C ^{[1
]}

机构：

[1] Univ Reims, Unite Therm & Anal Phys, EA 2061, Lab Thermophys,URCA,UTAP,LPT,UFR Sci, F-51687 Reims 2, France

来源：

INTERNATIONAL JOURNAL OF THERMAL SCIENCES | 2004年 / 43卷 / 12期

关键词：

anisotropic conductivity; mechanical stress; thermal modelling; lock-in detection; photothermal thermography; non-destructive testing;

D O I：

10.1016/j.ijthermalsci.2004.04.006

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

The present work consists in the development of a three-dimensional model of heat diffusion in orthotropic media, based on numerical Fourier transforms, and taking into account the extent of the source. This model has been applied, together with a Gauss-Newton parameter estimation procedure, to identify the components of the conductivity tensor of a steel bar under uniaxial loading. Few percent variations of the conductivity components have been observed for applied stresses remaining in the elastic domain. (C) 2004 Elsevier SAS. All rights reserved.

引用

页码：1161 / 1169

页数：9

共 50 条

[1] Stress-induced evolution of anisotropic thermal conductivity of dry granular materials
Jinhyun Choo
Young Jin Kim
Jung Hwoon Lee
Tae Sup Yun
Jangguen Lee
Young Seok Kim
Acta Geotechnica, 2013, 8 : 91 - 106
[2] Stress-induced evolution of anisotropic thermal conductivity of dry granular materials
Choo, Jinhyun
Kim, Young Jin
Lee, Jung Hwoon
Yun, Tae Sup
Lee, Jangguen
Kim, Young Seok
ACTA GEOTECHNICA, 2013, 8 (01) : 91 - 106
[3] Thermal Stress Induced Delamination of Through Silicon Vias in 3-D Interconnects
Lu, Kuan H.
Ryu, Suk-Kyu
Zhao, Qiu
Zhang, Xuefeng
Im, Jay
Huang, Rui
Ho, Paul S.
2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2010, : 40 - 45
[4] Multiaxial stress-induced thermal strains: constitutive modelling and laboratory findings
Crouch, RS
Petkovski, M
Waldron, P
COMPUTATIONAL MODELLING OF CONCRETE STRUCTURES, 2003, : 195 - 204
[5] Effective thermal conductivity of composite materials with 3-d microstructures and interfacial thermal resistance
Matt, Carlos F.
Cruz, Manuel E.
NUMERICAL HEAT TRANSFER PART A-APPLICATIONS, 2008, 53 (06) : 577 - 604
[6] Evolution of stress-induced thermal anisotropy in granular materials: A directed network perspective
Fei, Wenbin
Cui, Xianze
Narsilio, Guillermo A.
POWDER TECHNOLOGY, 2023, 415
[7] Effects of a realistic mantle thermal conductivity on the patterns of 3-D convection
Dubuffet, F
Yuen, DA
Rabinowicz, M
EARTH AND PLANETARY SCIENCE LETTERS, 1999, 171 (03) : 401 - 409
[8] Modelling the anisotropic thermal conductivity of 3D logpile structures
Moreno-Sanabria, L.
Barea, R.
Osendi, M. I.
Belmonte, M.
Miranzo, P.
JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, 2023, 43 (10) : 4462 - 4471
[9] 3-D thermal analysis
Electronic Packaging and Production, 1994, 34 (12):
[10] TRANSIENT 3-D MODELLING OF CEILING FAN FOR ACHIEVING THERMAL COMFORT
Anand, Y.
Verma, S. K.
Anand, S.
2018 BUILDING PERFORMANCE ANALYSIS CONFERENCE AND SIMBUILD, 2018, : 197 - 204

← 1 2 3 4 5 →