Through Mold Interconnection assessment for advanced Fan Out Wafer Level Packaging applications

被引：2
|
作者：
Plihon, Aurelia [1 ]
Deschaseaux, Edouard [1 ]
Franiatte, Remi [1 ]
Argoux, Maxime [1 ]
Dechamp, Jerome [1 ]
Guillaume, Jennifer [1 ]
Charbonnier, Jean [1 ]
机构：
[1] Univ Grenoble Alpes, CEA, LETI, Grenoble, France
来源：
2020 IEEE 8TH ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC) | 2020年
关键词：
TMI; EMC; FOWLP; daisy chain; RDL;
D O I：
10.1109/estc48849.2020.9229773
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
This study demonstrates the process feasibility and electrical performances of Through Mold Interconnections (TMI) integrated in a Fan Out Wafer Level Packaging (FOLWP) configuration. With an interesting aspect-ratio, a low pitch and a small diameter, the TMIs are assessed thanks to the connection to two Redistributions Layers (RDL) on each side of a chip embedded in an Epoxy Molding Compound (EMC). Single interconnection and several daisy chains have been electrically characterized and show low interconnection resistance.
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页数：4
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