Numerical simulation of heat and moisture transfer in porous walls with microencapsulated PCM

被引：0
|
作者：
Li, Y. [1 ]
Wang, X. [1 ]
Li, S. [1 ]
Niu, J. L. [2 ]
机构：
[1] Hong Kong Polytech Univ, Inst Text & Clothing, Hong Hom, Hong Kong, Peoples R China
[2] Hong Kong Polytech Univ, Dept Bldg Ser Engn, Hong Hom, Hong Kong, Peoples R China
来源：
COMPUTATIONAL TEXTILE | 2007年
关键词：
micro-encapsulated PCM; porous wall; model; simulation;
D O I：
暂无
中图分类号：
TP18 [人工智能理论];
学科分类号：
081104 ; 0812 ; 0835 ; 1405 ;
摘要：
This paper reports numerical simulations to analyze the thermal characteristics of three-layer wall with micro-encapsulated PCM based on the theoretical model of heat and moisture transfer in porous materials. The thermal characteristics of the wall system with different boundary conditions are analyzed by the computer simulation. The results show that the wall with encapsulated PCM can delay the temperature rise when the environmental temperature increases. The computational simulations are useful tool for designing building materials that can save energy in heating and air conditioning.
引用
收藏
页码：255 / +
页数：2
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