Hardware for production test of RFID interface embedded into chips for smart cards and labels used in contactless applications

被引：1

作者：

da Costa, C ^{[1
]}

机构：

[1] Teradyne Inc, Boston, MA 02118 USA

来源：

INTERNATIONAL TEST CONFERENCE 2000, PROCEEDINGS | 2000年

关键词：

D O I：

10.1109/TEST.2000.894241

中图分类号：

TP301 [理论、方法];

学科分类号：

081202 ;

摘要：

Application-oriented, production wafer test of the RFID interfaces embedded in VLSI devices such as contactless applications for smart cards and identification TAGs, falling in the frequency range below 20 MHz, require a specific testing solution. There must be external circuitry on the probe card with limits of the parallel test to 1 to 3 devices. A test solution embedded into standard ATE and capable of testing up to 32 dies in parallel, without any external circuits will be discussed in this paper.

引用

页码：485 / 491

页数：7