Foreword: Special Section on Packaging and Interconnects: Cutting-Edge Solutions in Modeling, Design, and Characterization-Part II

被引:1
|
作者
Telescu, Mihai [1 ]
Gu, Xiaoxiong [2 ]
Sharma, Rohit [3 ]
机构
[1] Univ Brest, F-29200 Brest, France
[2] IBM Res, Yorktown Hts, NY 10598 USA
[3] Indian Inst Technol Ropar, Dept Elect Engn, Rupnagar 140001, India
关键词
D O I
10.1109/TCPMT.2019.2942707
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
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页码:1929 / 1930
页数:2
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