Foreword: Special Section on Packaging and Interconnects: Cutting-Edge Solutions in Modeling, Design, and Characterization-Part II

被引：1

|

作者：

Telescu, Mihai ^{[1
]}

Gu, Xiaoxiong ^{[2
]}

Sharma, Rohit ^{[3
]}

机构：

[1] Univ Brest, F-29200 Brest, France

[2] IBM Res, Yorktown Hts, NY 10598 USA

[3] Indian Inst Technol Ropar, Dept Elect Engn, Rupnagar 140001, India

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2019年 / 9卷 / 10期

关键词：

D O I：

10.1109/TCPMT.2019.2942707

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

收藏

页码：1929 / 1930

页数：2

相关论文

共 6 条

[1] Foreword: Special Section on Packaging and Interconnects: Cutting-Edge Solutions in Modeling, Design, and Characterization-Part I
Telescu, Mihai
Gu, Xiaoxiong
Sharma, Rohit
[J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2019, 9 (09): : 1667 - 1668
[2] Special Section on Cutting-Edge Technologies of Superconducting Electronics FOREWORD
Fujimaki, Akira
[J]. IEICE TRANSACTIONS ON ELECTRONICS, 2016, E99C (06): : 667 - 668
[3] Special Section on Recent Progress in Superconductor Sensors and Detectors for Cutting-Edge Technologies FOREWORD
Myoren, Hiroaki
[J]. IEICE TRANSACTIONS ON ELECTRONICS, 2020, E103C (05): : 197 - 197
[4] Foreword for the Special Section on ESD Modeling, Characterization, and Design
Boselli, Gianluca
[J]. IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2013, 13 (02) : 370 - 370
[5] Foreword: Special Section on Advanced Packaging, Materials, Processing, and Reliability: Cutting-Edge Solutions for High-Density Wafer-/Panel-Level and Thin, Flexible, Mobile Packages
Bock, Karlheinz
[J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2020, 10 (01): : 3 - 4
[6] Foreword: Special Section on "The Reliability of Advanced Microelectronic Packaging-Part II: Structure-Property Relationships"
Qin, Wentao
Li, Yan
[J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2020, 10 (10): : 1587 - 1588