Design and Analysis of Silicon Carbide Microneedle for Transdermal Drug Delivery

被引:0
|
作者
Sawon, M. A. [1 ]
Samad, M. F. [1 ]
机构
[1] Rajshahi Univ Engn & Technol, Dept Elect & Telecommun Engn, Rajshahi, Bangladesh
关键词
microneedle; transdermal drug delivery; side port; bending force; compressive force;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, we present an out-of-plane microneedle for transdermal drug delivery application. The proposed design is strong enough to reduce stresses and deformation having a length of 380 mu m, outer diameter of 70 mu m, and inner diameter of 40 mu m. The dimension of the proposed microstructured needle can be a model for painless drug delivery. A side port design of microneedle is conducted for an efficient drug delivery. The analysis and simulation of the design has been carried out using COMSOL Multiphysics where different materials are used. Silicon Carbide (SiC) based microneedle has been performed as a less deformation microneedle compared to the other selected materials. Moreover, the simulation result represents a significant change in stress with the variation of the needle tip area. The bending and the compressive force analysis are also examined which determines that the microneedle can withstand without breaking if the generated stress at the needle body is under the yield strength of the material.
引用
收藏
页码:1343 / 1346
页数:4
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