Laser-assisted direct ink writing of planar and 3D metal architectures

被引:247
|
作者
Skylar-Scott, Mark A. [1 ,2 ]
Gunasekaran, Suman [1 ]
Lewis, Jennifer A. [1 ,2 ]
机构
[1] Harvard Univ, John A Paulson Sch Engn & Appl Sci, Cambridge, MA 02138 USA
[2] Harvard Univ, Wyss Inst Biol Inspired Engn, Cambridge, MA 02138 USA
关键词
3D printing; flexible electronics; conductive interconnects; silver ink; laser annealing; TRANSPARENT ELECTRODES; METAMATERIALS; GRAPHENE; MEMS; READ;
D O I
10.1073/pnas.1525131113
中图分类号
O [数理科学和化学]; P [天文学、地球科学]; Q [生物科学]; N [自然科学总论];
学科分类号
07 ; 0710 ; 09 ;
摘要
The ability to pattern planar and freestanding 3D metallic architectures at the microscale would enable myriad applications, including flexible electronics, displays, sensors, and electrically small antennas. A 3D printing method is introduced that combines direct ink writing with a focused laser that locally anneals printed metallic features "on-the-fly." To optimize the nozzle-to-laser separation distance, the heat transfer along the printed silver wire is modeled as a function of printing speed, laser intensity, and pulse duration. Laser-assisted direct ink writing is used to pattern highly conductive, ductile metallic interconnects, springs, and freestanding spiral architectures on flexible and rigid substrates.
引用
收藏
页码:6137 / 6142
页数:6
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