Electron back scattered diffraction characterization of thermomechanical fatigue crack propagation of a near α titanium alloy Timetal 834

被引:15
|
作者
Prasad, Kartik [1 ]
Karamched, Phani S. [1 ]
Bhattacharjee, A. [1 ]
Kumar, Vikas [1 ]
Rao, K. Bhanu Sankara [2 ]
Sundararaman, M. [3 ]
机构
[1] Def Met Res Lab, Hyderabad 500258, Andhra Pradesh, India
[2] Mahatma Gandhi Inst Technol, Hyderabad, Andhra Pradesh, India
[3] Univ Hyderabad, Sch Engn Sci & Technol, Hyderabad 500134, Andhra Pradesh, India
关键词
Schmid factor; fracture; crystal plasticity; slip; microstructure; GROWTH-BEHAVIOR; ELEVATED-TEMPERATURES; TI-ALLOY; MICROTEXTURE; DEFORMATION; TI-6AL-4V; GRADIENTS; DUCTILE; IMI-834; FLOW;
D O I
10.1016/j.matdes.2014.09.006
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Fatigue crack growth (FCG) mechanisms have been studied in light of the interaction of a propagating crack with local crystallographic orientations of primary alpha (alpha(P)) and secondary alpha (alpha(S)) colonies in a near alpha Timetal 834 Ti-alloy under thermomechanical fatigue (TMF) loading using electron backscattered diffraction (EBSD). FCG testing at in-phase (IP) and out-of-phase (OP) TMF loading have been carried out at two temperature intervals 300 degrees C <-> 450 degrees C and 450 degrees C <-> 600 degrees C. EBSD analysis and microhardness measurements have confirmed that larger cyclic plastic zone size at the crack tip leads to lower crack propagation under IP-TMFCG loading as compared to OP-TMFCG loading. EBSD analysis has also confirmed that crack dissipates more energy to propagate when it passes from a soft grain oriented with its c-axis normal to the loading direction and encounters a hard grain with its c-axis parallel with the loading direction. (C) 2014 Elsevier Ltd. All rights reserved.
引用
收藏
页码:297 / 311
页数:15
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