Pulsed deposition of ultra-thin copper foils

被引：0
|
作者：
Huang, CH [1 ]
Shu, WY
Wu, HM
Lee, CH
机构：
[1] Soochow Univ, Dept Chem, Taipei, Taiwan
[2] Chung Shan Inst Sci & Technol, Lungtan, Taiwan
[3] Republ Anode Fabricators, Strongsville, OH USA
来源：
PLATING AND SURFACE FINISHING | 2004年 / 91卷 / 09期
关键词：
D O I：
暂无
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
Ultra-thin 5-mum (197-mu-in.) copper foil was prepared by pulse plating onto stainless steel from an acid copper electrolyte which contained 2 ppm of a gelatin having a molecular weight (MW) below 50,000. In addition to the advantage of being pinhole-free, the copper foil obtained was also free of internal stress. Moreover, these copper foils had high tensile strength to provide desired handleability.
引用
收藏
页码：34 / 38
页数：5
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