Mechanical properties and oxidation resistance of Sn-Zn-xCu (2.3 ≤ x ≤ 20.2) solder alloys prepared by high-throughput strategy

被引：8
|
作者：
Geng, Chuan [1 ]
Jia, Yandong [1 ]
Ma, Xindi [1 ]
Jia, Yuefei [1 ]
Mu, Yongkun [1 ]
Wang, Gang [1 ]
Li, Caiju [2 ]
Peng, Jubo [3 ]
Bao, Qinghuang [3 ]
机构：
[1] Shanghai Univ, Inst Mat, Lab Microstruct, Shanghai 200444, Peoples R China
[2] Kunming Univ Sci & Technol, Fac Mat Sci & Engn, Kunming 650093, Yunnan, Peoples R China
[3] Yunnan Tin Grp Holding Co Ltd, Kunming 650093, Yunnan, Peoples R China
来源：
MANUFACTURING LETTERS | 2021年 / 27卷
基金：
中国国家自然科学基金;
关键词：
High-throughput strategy; Sn-Zn-Cu solder alloy; Young's modulus; Oxidation resistance; CU; MICROSTRUCTURE; COMBINATORIAL; SUBSTRATE; EVOLUTION; ELEMENTS; AL;
D O I：
10.1016/j.mfglet.2020.11.005
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Sn-Zn-Cu solder alloys are predominantly developed through a sequential and time-consuming trial-and-error approach. Here, it is presented that Cu-doped Sn-Zn-based solder alloy thin films can be fabricated by high-throughput strategy. The influence of Cu content on the phase constitution, mechanical properties and oxidation resistance of the Sn-Zn-Cu thin films was investigated in detail. The highest Young's modulus of the film can be obtained with the addition of 2.3 wt% Cu. Superior oxidation resistance is expected to be acquired with low Cu content. Our results demonstrate that the combination of multiple target co-sputtering deposition is an effective way for rapidly developing lead-free solder. (C) 2020 Society of Manufacturing Engineers (SME). Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码：47 / 52
页数：6
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