Synthesis and Dielectric Properties of Epoxy based Nanocomposites

被引：0
|
作者：
Andritsch, T. [1 ]
Kochetov, R. [1 ]
Gebrekiros, Y. T. [1 ]
Lafont, U. [1 ]
Morshuis, P. H. F. [1 ]
Smit, J. J. [1 ]
机构：
[1] Delft Univ Technol, Delft, Netherlands
来源：
CEIDP: 2009 ANNUAL REPORT CONFERENCE ON ELECTRICAL INSULATION AND DIELECTRIC PHENOMENA | 2009年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Insulation based on epoxy resin is widely used in high voltage applications. This paper shows the formulation of epoxy based nanocomposites and the influence of the filler material on the DC breakdown strength. Filler materials discussed are SiO2, Al2O3 and AlN with average particle size between 22 and 100nm. AlN has been chosen because it has shown to considerably increase the thermal conductivity of epoxy resin. SiO2 and Al2O3 are widely used as filler for electrical applications since they improve mechanical, thermal and electrical properties, beside neat epoxy samples, which have been used as reference. Base material for all samples is conventional bisphenol-A type epoxy resin with anhydrite hardener. Particle size and dispersion within the epoxy matrix have been validated via transmission electron microscopy. Breakdown measurements have been performed by means of DC ramp tests. Results of nano-Al2O3 samples have also been compared with surface functionalized microscale filler.
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页码：440 / 443
页数：4
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