High temperature breakdown of the Stokes-Einstein relation in a computer simulated Cu-Zr melt

被引:29
|
作者
Han, X. J. [1 ]
Li, J. G. [1 ]
Schober, H. R. [2 ]
机构
[1] Shanghai Jiao Tong Univ, Sch Mat Sci & Engn, Dongchuan Rd 800, Shanghai 200240, Peoples R China
[2] Forschungszentrum Julich, Peter Grunberg Inst, D-52425 Julich, Germany
来源
JOURNAL OF CHEMICAL PHYSICS | 2016年 / 144卷 / 12期
基金
高等学校博士学科点专项科研基金; 中国国家自然科学基金;
关键词
SPATIALLY HETEROGENEOUS DYNAMICS; GLASS-TRANSITION; SUPERCOOLED LIQUIDS; PAIR-CORRELATION; DIFFUSION; POTENTIALS;
D O I
10.1063/1.4944081
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
Transport properties and the Stokes-Einstein (SE) relation in liquid Cu8Zr3 are studied by molecular dynamics simulation with a modified embedded atom potential. The critical temperature T-c of mode coupling theory (MCT) is derived as 930 K from the self-diffusion coefficient D and viscosity eta. The SE relation breaks down around T-SE = 1900 K, which is far above T-c. At temperatures below T-SE, the product of D and eta fluctuates around a constant value, similar to the prediction of MCT near T-c. The influence of the microscopic atomic motion on macroscopic properties is investigated by analyzing the time dependent liquid structure and the self-hole filling process. The self-holes for the two components are preferentially filled by atoms of the same component. The self-hole filling dynamics explains the different breakdown behaviors of the SE relation in Zr-rich liquid CuZr2 compared to Cu-rich Cu8Zr3. At T-SE, a kink is found in the temperature dependence of both partial and total coordination numbers for the three atomic pair combinations and of the typical time of self-hole filling. This indicates a strong correlation between liquid structure, atomic dynamics, and the breakdown of SE relation. The previously suggested usefulness of the parameter d(D-1/D-2)/dT to predict T-SE is confirmed. Additionally we propose a viscosity criterion to predict T-SE in the absence of diffusion data. (C) 2016 AIP Publishing LLC.
引用
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页数:14
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