Investigation of the high temperature stability of TiN-Al2O3-TiN capacitors for sub 50nm deep trench DRAM

被引:0
|
作者
Boescke, T. [1 ,2 ]
Kudelka, S. [1 ]
Saenger, A. [1 ]
Mueller, J. [2 ]
Krautschneider, W. [2 ]
机构
[1] Qimonda GmbH, Dresden, Germany
[2] Tech Univ Hamburg, Hamburg, Germany
来源
ESSDERC 2006: PROCEEDINGS OF THE 36TH EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE | 2006年
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper deals with the investigation of mechanisms leading to a degradation of the electrical properties of titanium nitride - aluminum oxide - titanium nitride capacitors at high temperatures. Several degradation mechanisms could be identified by thorough electrical and physical characterization. The findings will serve as a future guide to build thermally stable MIM capacitors.
引用
收藏
页码:391 / +
页数:2
相关论文
共 50 条
  • [1] Good high-temperature stability of TiN/Al2O3/WN/TiN capacitors
    Pan, Tung-Ming
    Hsieh, Chun-I
    Huang, Tsai-Yu
    Yang, Jian-Ron
    Kuo, Pin-Sun
    IEEE ELECTRON DEVICE LETTERS, 2007, 28 (11) : 954 - 956
  • [2] Tetragonal phase stabilization by doping as an enabler of thermally stable HfO2 based MIM and MIS capacitors for sub 50nm deep trench DRAM
    Boescke, T. S.
    Govindarajan, S.
    Fachmann, C.
    Heitmann, J.
    Avellan, A.
    Schroeder, U.
    Kudelka, S.
    Kirsch, P. D.
    Krug, C.
    Hung, P. Y.
    Song, S. C.
    Ju, B. S.
    Price, J.
    Pant, G.
    Gnade, B. E.
    Krautschneider, W.
    Lee, B. -H.
    Jammy, R.
    2006 INTERNATIONAL ELECTRON DEVICES MEETING, VOLS 1 AND 2, 2006, : 934 - +
  • [3] Highly reliable TiN/ZO 2/TiN 3D stacked capacitors for 45 nm embedded DRAM technologies
    Berthelot, A.
    Caillat, C.
    Huard, V.
    Barnola, S.
    Boeck, B.
    Del-Puppo, H.
    Emonet, N.
    Lalanne, F.
    ESSDERC 2006: PROCEEDINGS OF THE 36TH EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE, 2006, : 343 - +
  • [4] A fully integrated Al2O3 trench capacitor DRAM for sub-100nm technology
    Seidl, H
    Gutsche, M
    Schroeder, U
    Birner, A
    Hecht, T
    Jakschik, S
    Luetzen, J
    Kerber, M
    Kudelka, S
    Popp, T
    Orth, A
    Reisinger, H
    Saenger, A
    Schupke, K
    Sell, B
    INTERNATIONAL ELECTRON DEVICES 2002 MEETING, TECHNICAL DIGEST, 2002, : 839 - 842
  • [5] Investigation of ultrathin Pt/ZrO2-Al2O3-ZrO2/TiN DRAM capacitors Schottky barrier height by internal photoemission spectroscopy
    Lee, Sang Yeon
    Chang, Jaewan
    Choi, Jaehyung
    Kim, Younsoo
    Lim, HanJin
    Jeon, Hyeongtag
    Seo, Hyungtak
    CURRENT APPLIED PHYSICS, 2017, 17 (02) : 267 - 271
  • [6] 5.1 Å EOT and low leakage TiN/Al2O3/Hf0.5Zr0.5O2/Al2O3/TiN heterostructure for DRAM capacitor
    Luo, Zhen
    Du, Xinzhe
    Gan, Hui
    Lin, Yue
    Yan, Wensheng
    Shen, Shengchun
    Yin, Yuewei
    Li, Xiaoguang
    APPLIED PHYSICS LETTERS, 2023, 122 (19)
  • [7] Manufacturing and structure investigation of TiN-Al2O3-multilayers
    Inst. Festkorper- W., P.O. Box 270016, D-01171, Dresden, Germany
    Nanostruct Mater, 8 (1101-1109):
  • [8] Manufacturing and structure investigation of TiN-Al2O3-multilayers
    Bauer, HD
    Arnold, B
    Bartsch, K
    Rennekamp, R
    Leonhardt, A
    NANOSTRUCTURED MATERIALS, 1999, 11 (08): : 1101 - 1109
  • [9] High-Performance TiN/Al2O3/ZnO/Al2O3/TiN Flexible RRAM Device With High Bending Condition
    Kumar, Dayanand
    Chand, Umesh
    Siang, Lew Wen
    Tseng, Tseung-Yuen
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2020, 67 (02) : 493 - 498
  • [10] Effect of High Pressure Annealing Temperature on the Ferroelectric Properties of TiN/Hf0.25Zr0.75O2/TiN Capacitors
    Jeon, Sanghun
    Das, Dipjyoti
    Gaddam, Venkateswarlu
    2020 IEEE ELECTRON DEVICES TECHNOLOGY AND MANUFACTURING CONFERENCE (EDTM 2020), 2020,