Complete Indium-free CW 200W Passively Cooled High Power Diode Laser Array Using Double-side Cooling Technology

被引：2

作者：

Wang, Jingwei ^{[1
]}

Zhu, Pengfei ^{[1
]}

Liu, Hui ^{[2
]}

Liang, Xuejie ^{[1
]}

Wu, Dihai ^{[2
]}

Liu, Yalong ^{[1
]}

Yu, Dongshan ^{[1
]}

Zah, Chung-en ^{[1
]}

Liu, Xingsheng ^{[1
,2
]}

机构：

[1] Focuslight Technol Inc, High Tech Zone, 56 Zhangba 6th Rd, Xian 710077, Shaanxi, Peoples R China

[2] Chinese Acad Sci, Xian Inst Opt & Precis Mech, State Key Lab Transient Opt & Photon, Xian Hitech Ind Dev Zone, 17 Xinxi Rd,New Ind Pk, Xian 710119, Shaanxi, Peoples R China

来源：

COMPONENTS AND PACKAGING FOR LASER SYSTEMS III | 2017年 / 10085卷

关键词：

Diode laser; complete indium-free; passively cooled; double-side cooling; reliability;

D O I：

10.1117/12.2253442

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

High power diode lasers have been widely used in many fields. To meet the requirements of high power and high reliability, passively cooled single bar CS-packaged diode lasers must be robust to withstand thermal fatigue and operate long lifetime. In this work, a novel complete indium-free double-side cooling technology has been applied to package passively cooled high power diode lasers. Thermal behavior of hard solder CS-package diode lasers with different packaging structures was simulated and analyzed. Based on these results, the device structure and packaging process of double-side cooled CS-packaged diode lasers were optimized. A series of CW 200W 940nm high power diode lasers were developed and fabricated using hard solder bonding technology. The performance of the CW 200W 940nm high power diode lasers, such as output power, spectrum, thermal resistance, near field, far field, smile, lifetime, etc., is characterized and analyzed.

引用

页数：10

共 5 条

[1] Passively cooled diode lasers in the cw power range of 120 to 200W
Lorenzen, Dirk
Meusel, Jens
Schroeder, Dominic
Hennig, Petra
HIGH-POWER DIODE LASER TECHNOLOGY AND APPLICATIONS VI, 2008, 6876
[2] Packaging of Complete Indium-free High Reliable and High Power Diode Laser Array
Wang, Jingwei
Li, Xiaoning
Feng, Feifei
Liu, Yalong
Hou, Dong
Liu, Xingsheng
XX INTERNATIONAL SYMPOSIUM ON HIGH-POWER LASER SYSTEMS AND APPLICATIONS 2014, 2015, 9255
[3] Packaging of High Power Density Double Quantum Well Semiconductor Laser Array Using Double-side Cooling Technology
Wang, Jingwei
Zhang, Pu
Xiong, Lingling
Li, Xiaoning
Yuan, Zhenbang
Guo, Lu
Liu, Xingsheng
2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011, : 1152 - 1156
[4] High Power Diode Laser Array Development using Completely Indium Free Packaging Technology with Narrow Spectrum
Hou, Dong
Wang, Jingwei
Gao, Lijun
Liang, Xuejie
Li, Xiaoning
Liu, Xingsheng
COMPONENTS AND PACKAGING FOR LASER SYSTEMS II, 2016, 9730
[5] Demonstration of side coupling between high power laser diode array and double-clad fiber using sub-wavelength grating
Huang, Chieh-Wei
Huang, Ding-Wei
Chang, Chun-Lin
Jheng, Dong-Yo
Hsu, Kuang-Yu
Kuan, Chieh-Hsiung
Huang, Sheng-Lung
2011 CONFERENCE ON LASERS AND ELECTRO-OPTICS (CLEO), 2011,

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