Surface-micromachined flexible polysilicon sensor array

被引:0
|
作者
Hwang, ES [1 ]
Kim, YJ [1 ]
Ju, BK [1 ]
机构
[1] Yonsei Univ, Dept Mech Engn, Sodaemoon Gu, Seoul 120749, South Korea
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A flexible polysilicon strain gauge array has been realized using surface micromachining with SiO2 sacrificial layer. The realized sensor array is mechanically flexible, which can be attached on non-planar surfaces. To realize the flexible strain gauge, a new packaging scheme using polysilicon/oxide based surface-micromachining was developed. The proposed packaging scheme completes the strain sensors and the circuit board on a single process, which eliminates additional assembly and alignment problems. The measured gauge factor shows that it is more sensitive than metal strain gauge. Unlike a single-crystal silicon strain gauge, the proposed polysilicon gauge does not have any limitations in the direction of strain.
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页码:582 / 585
页数:4
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