Study of free air ball formation in Ag-8Au-3Pd alloy wire bonding

被引：12
|
作者：
Guo, Rui [1 ]
Gao, Liming [1 ]
Mao, Dali [1 ]
Li, Ming [1 ]
Wang, Xu [2 ]
Lv, Zhong [2 ]
Chiu, Hope [2 ]
机构：
[1] Shanghai Jiao Tong Univ, Sch Mat Sci & Engn, State Key Lab Met Matrix Composites, Shanghai 200240, Peoples R China
[2] SanDisk Semicond Shanghai Co Ltd, Packaging RnD & Adv MFG Engn, Shanghai 200241, Peoples R China
来源：
MICROELECTRONICS RELIABILITY | 2014年 / 54卷 / 11期
关键词：
Ag-8Au-3Pd alloy wire; Electronic flame-off; Free air ball; Auger electron spectroscopy; COPPER; INTERMETALLICS; BEHAVIOR;
D O I：
10.1016/j.microrel.2014.04.005
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
An innovative Ag-8Au-3Pd alloy Wire has been developed as an alternative to the traditional gold wire bonding. This paper focused on the free air ball (FAB) formation of 0.7 mil Ag-8Au-3Pd alloy wire, which was vital for the yield of the subsequent bonding process. During electric flame-off (EFO) process, the wire tail was melted by a high voltage spark, and then the FAB was shaped by the effects of surface tension and gravity. The EFO current was the key factor to influence the Ag-8Au-3Pd alloy FAB size and morphology due to the energy input via arc discharging. The defects including off-center and ripple appeared on the Ag-8Au-3Pd alloy FABs were discussed by cooling and solidification. It is suggested that low EFO current will effectively avoid FAB defects. The contaminants on the Ag-8Au-3Pd alloy FAB surface were analyzed by Auger electron spectroscopy (AES). Under the protection of the shielding gas, oxidation and sulfuration have been effectively prevented. (C) 2014 Elsevier Ltd. All rights reserved.
引用
收藏
页码：2550 / 2554
页数：5
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