Low temperature growth of stress-free single phase α-W films using HiPIMS with synchronized pulsed substrate bias

Efficient metal-ion-irradiation during film growth with the concurrent reduction of gas-ion-irradiation is realized for high power impulse magnetron sputtering by the use of a synchronized, but delayed, pulsed substrate bias. In this way, the growth of stress-free, single phase alpha -W thin films is demonstrated without additional substrate heating or post-annealing. By synchronizing the pulsed substrate bias to the metal-ion rich portion of the discharge, tungsten films with a 110 oriented crystal texture are obtained as compared to the 111 orientation obtained using a continuous substrate bias. At the same time, a reduction of Ar incorporation in the films are observed, resulting in the decrease of compressive film stress from sigma =1.80-1.43GPa when switching from continuous to synchronized bias. This trend is further enhanced by the increase of the synchronized bias voltage, whereby a much lower compressive stress sigma =0.71GPa is obtained at U-s=200V. In addition, switching the inert gas from Ar to Kr has led to fully relaxed, low tensile stress (0.03GPa) tungsten films with no measurable concentration of trapped gas atoms. Room-temperature electrical resistivity is correlated with the microstructural properties, showing lower resistivities for higher U-s and having the lowest resistivity (14.2 mu Omega cm) for the Kr sputtered tungsten films. These results illustrate the clear benefit of utilizing selective metal-ion-irradiation during film growth as an effective pathway to minimize the compressive stress induced by high-energetic gas ions/neutrals during low temperature growth of high melting temperature materials.