Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components

被引：8

作者：

Vandevelde, Bart ^{[1
]}

Vanhee, Filip ^{[2
]}

Pissoort, Davy ^{[2
]}

Degrendele, Lieven ^{[3
]}

De Baets, Johan ^{[3
]}

Allaert, Bart ^{[4
]}

Lauwaert, Ralph ^{[5
]}

Zanon, Franco ^{[1
]}

Labie, Riet ^{[1
]}

Willems, Geert ^{[1
]}

机构：

[1] IMEC, B-3001 Leuven, Belgium

[2] Katholieke Univ Leuven, Technol Campus Ostend, Oostende, Belgium

[3] IMEC, Ghent, Belgium

[4] Connect Grp, Ieper, Belgium

[5] Interflux Elect, Ghent, Belgium

来源：

MICROELECTRONICS RELIABILITY | 2017年 / 74卷

关键词：

Thermal cycling; Solder joint fatigue testing; Bending cycling; Chip Scale Packages; Life time prediction;

D O I：

10.1016/j.microrel.2017.04.008

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper deals with an alternative testing approach for quantifying the life time of board level solder joint reliability of components. This approach consists of applying a relative shear displacement between component and Printed Circuit Board (PCB) through cyclic board bending. During the cycling, the temperature is kept constant, preferably at elevated temperature in order to accelerate the creep deformation of the solder joint. This is done in a four-point bending setup which allows to apply an equal loading on all components lying between the inner bars. The scope of the paper is, firstly, to evaluate if the four point bending testing generates the same fatigue fracture as in thermal cycling; secondly, that the measured life times can be also predicted through finite element simulations; and thirdly if the technique can finally accelerate the cycling frequency to reduce the testing time. (C) 2017 Elsdvier Ltd. All rights reserved.

引用

页码：131 / 135

页数：5

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