Effects of electrical field treatment on recrystallization of copper single crystal

被引：11
|
作者：
Liu, W [1 ]
Wu, TK [1 ]
Godfrey, A [1 ]
Liu, Q [1 ]
机构：
[1] Tsing Hua Univ, Dept Mat Sci & Engn, Beijing 100084, Peoples R China
来源：
SCRIPTA MATERIALIA | 2005年 / 52卷 / 06期
基金：
中国国家自然科学基金;
关键词：
electric field; copper; recrystallization; twins;
D O I：
10.1016/j.scriptamat.2004.11.004
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
The effects of an electrical field on recrystallization of Cu have been investigated. A 12degrees off exact (112) [11 (1) over bar] copper single crystal was rolled to 80% reduction. Samples cut from the deformed material were then annealed for 1 h at temperatures of between 200 degreesC and 400 degreesC. For each temperature, samples were annealed either with or without the presence of an electfical field of intensity 1500 V/cm. The microstructures were investigated in the longitudinal plane by using the electron backscatter pattern technique. Results show that the application of an external electric field might promote the grain growth rate. and also promote the formation of Sigma3 twin boundary. (C) 2004 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码：495 / 499
页数：5
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