Dynamic crack propagation prediction of solder joints under impact conditionsac

被引：4
|
作者：
Towashiraporn, Pongpinit [1 ]
Crosbie, Paul [1 ]
Brown, Matt [1 ]
Cavallaro, Alberto [1 ]
机构：
[1] Motorola Inc, 600 N US Highway 45, Libertyville, IL 60048 USA
来源：
57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS | 2007年
关键词：
D O I：
10.1109/ECTC.2007.373871
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Failure predictive modeling based on cohesive constitutive relation is used to study the effect of solder-joint array geometry on the integrity of live solder joints. The dynamic overstress state and crack propagation of the interface between the solder and the pad results in complete interface separation. This failure mode is predominant under impact conditions and is captured accurately by a numerical model. Package-level drop tests were simulated and experimentally validated by a 4-point dynamic bend system.
引用
收藏
页码：689 / +
页数：2
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