共 12 条
- [1] Direct Numerical Simulation of Breakup Characteristics of Power Law Fluid Impingement Jet Tuijin Jishu/Journal of Propulsion Technology, 2020, 41 (08): : 1895 - 1902
- [2] Integration of Jet Impingement Cooling With Direct Bonded Copper Substrates for Power Electronics Thermal Management IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2019, 9 (02): : 226 - 234
- [5] Development of a Highly Integrated 10 kV SiC MOSFET Power Module with a Direct Jet Impingement Cooling System PRODCEEDINGS OF THE 2018 IEEE 30TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS (ISPSD), 2018, : 256 - 259
- [6] COMPARATIVE ANALYSIS OF DIRECT AND INDIRECT COOLING OF WIDE-BANDGAP POWER MODULES AND PERFORMANCE ENHANCEMENT OF JET IMPINGEMENT-BASED DIRECT SUBSTRATE COOLING PROCEEDINGS OF ASME 2022 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, INTERPACK2022, 2022,
- [7] Demonstration of Package Level 3D-printed Direct Jet Impingement Cooling applied to High power, Large Die Applications 2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020), 2020, : 1422 - 1429
- [9] High efficiency direct liquid jet impingement cooling of high power devices using a 3D-shaped polymer cooler 2017 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), 2017,
- [10] 3D-Printed Direct Liquid Multi-Jet Impingement Cooling Solutions for Power Electronics in Electrified Automotive Transportation 2024 30TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS, THERMINIC 2024, 2024,