Investigation for kinetics law of oxidation of a nano-scale copper film

被引:0
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作者
Min, Jiang [1 ]
机构
[1] Fudan Univ, Dept Mat Sci, Shanghai 200433, Peoples R China
关键词
cu thin film; oxidation; kinetics characterization; sheet resistance; transmission spectrum;
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暂无
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
Oxidation behaviour of a nano-scale copper film at 140 V was investigated in this paper. Nano-scale copper films were prepared on glass substrate by vacuum deposition at different depositing rates. Atomic force microscope (AFM) was applied to characterization of the surface morphology of these thin films to choose suitable samples. Kinetics of the oxidation process of the copper films in the thickness range of 16-22 nm at 140 V was studied by using transmission spectrum and sheet resistance methods. The crystal structures and compositions of the oxidation products were analyzed with X-ray diffraction (XRD). The results show that the copper was oxidized to form Cu2O following a cubic rate law at 140 V.
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页码:1521 / 1526
页数:6
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