High-density multi-mode photonic backplane

被引：0

作者：

Shih, MY ^{[1
]}

Erben, C ^{[1
]}

Gorczyca, T ^{[1
]}

Dasgupta, S ^{[1
]}

Balch, E ^{[1
]}

Claydon, G ^{[1
]}

Tolliver, T ^{[1
]}

Guida, R ^{[1
]}

Kornrumpf, W ^{[1
]}

Nielsen, M ^{[1
]}

Breitung, E ^{[1
]}

机构：

[1] Gen Elect Global Res Ctr, Niskayuna, NY 12309 USA

来源：

NANOENGINEERING: FABRICATION, PROPERTIES, OPTICS, AND DEVICES | 2004年 / 5515卷

关键词：

optoelectronic integration; VCSEL; micro-optics; multimode waveguide; backplane;

D O I：

10.1117/12.560093

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The development of a photonic backplane for high-speed and high-bandwidth communications is presented. This hybrid, multimode, multi-channel backplane structure contains both electrical and optical interconnects, suitable for next-generation high-speed servers with terabit backplane capacity. Removable and all-passively aligned high density interconnects on this backplane are achieved by polymer based optical waveguides with integrated micro-optics and VCSEL arrays on conventional printed circuit boards. The fabrication of this photonic backplane requires few additional steps outside a traditional board-manufacturing environment and is largely compatible with existing processes.

引用

页码：24 / 29

页数：6

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