High precision, small geometry laser trimming for emerging microelectronics devices - art. no. 64590K

被引：0

作者：

Gu, Bo ^{[1
]}

机构：

[1] GSI Grp, Wilmington, MA USA

来源：

Laser-based Micro- and Nanopackaging and Assembly | 2007年 / 6459卷

关键词：

laser trimming; wafer trim; thin film resistors; green laser trimming; ultra violet laser;

D O I：

10.1117/12.701145

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Laser trimming of microelectronics devices has enabled the fabrication of high precision and high performance components and networks. Market demands for decreasing package size and higher performance components have pushed the current laser trimming technology to its limits. To meet the challenges, laser trimming system manufacturers have been working on the new generation based on significant advances in laser technology, software tools, and related system technologies. These new systems can achieve higher accuracy needed for processing devices with ever shrinking dimensions and tighter tolerances while offering maintenance-free operation and flexibility in today's demanding production environments. We will present in this paper the latest advancement of laser based trimming systems. Future directions will also be discussed.

引用

页码：K4590 / K4590

页数：7

共 10 条

[1] Pulsed-laser deposition of high-k titanium silicate thin films -: art. no. 054912
Brassard, D
El Khakani, MA
JOURNAL OF APPLIED PHYSICS, 2005, 98 (05)
[2] High accurate bistable temperature control of external cavity laser diode - art. no. 60202K
Qi, Y
Jie, J
Optoelectronic Materials and Devices for Optical Communications, 2005, 6020 : K202 - K202
[3] Inspection sensitivity improvement through optimization of lobe blocking on high end memory devices - art. no. 65182K
Lee, Changgoo
Won, Sera
Seo, Daeyoung
Kim, Hyeonsoo
Kim, Jinwoong
Yeo, Jeong-Ho
Dolev, Ido
Kwak, Chan-Hee
Metrology, Inspection, and Process Control for Microlithography XXI, Pts 1-3, 2007, 6518 : K5182 - K5182
[4] Study on a small modulation and high precision laser range finder using the self-mixing effect in a single-mode VCSEL - art. no. 68381M
Wang, Huanqin
Zhao, Tianpeng
Xu, Jun
He, Deyong
Yang, Jiwen
OPTOELECTRONIC DEVICES AND INTEGRATION II, 2008, 6838 : M8381 - M8381
[5] Features of kinetics of clusters formation under intensive evaporation of small solid particles by short laser pulses - art. no. 69850K
Lukyanov, German A.
Simakova, Olga I.
Bykov, Nikolay Yu.
FUNDAMENTALS OF LASER ASSISTED MICRO- AND NANOTECHNOLOGIES, 2008, 6985 : K9850 - K9850
[6] High-output very small aperture laser and its near-field distribution properties - art. no. 60200L
Gan, QQ
Song, SF
Chen, LH
Optoelectronic Materials and Devices for Optical Communications, 2005, 6020 : L200 - L200
[7] Time-resolved x-ray K-shell spectra from high density plasmas generated by ultrashort laser pulses -: art. no. 026407
Andiel, U
Eidmann, K
Witte, K
PHYSICAL REVIEW E, 2001, 63 (02):
[8] Phase separation and interfacial reaction of high-k HfAlOx films prepared by pulsed-laser deposition in oxygen-deficient ambient - art. no. 072906
Qiu, XY
Liu, HW
Fang, F
Ha, MJ
Liu, JM
APPLIED PHYSICS LETTERS, 2006, 88 (07)
[9] Hybrid titanium-aluminum oxide layer as alternative high-k gate dielectric for the next generation of complementary metal-oxide-semiconductor devices -: art. no. 042904
Auciello, O
Fan, W
Kabius, B
Saha, S
Carlisle, JA
Chang, RPH
Lopez, C
Irene, EA
Baragiola, RA
APPLIED PHYSICS LETTERS, 2005, 86 (04) : 042904 - 1
[10] Ultraviolet emission intensity, visible luminance, and electrical characteristics of small arrays of Al/Al2O3 microcavity plasma devices operating in Ar/N2 or Ne at high-power loadings -: art. no. 026107
Park, SJ
Kim, KS
Eden, JG
JOURNAL OF APPLIED PHYSICS, 2006, 99 (02) : 1 - 3

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