Copper Incorporated Nickel Sulphide on Ni-Foam: Binder-Free Electrode for High Performance Supercapacitors

被引：2
|
作者：
Nandhini, S. [1 ]
Rajagopalan, T. [1 ]
Muralidharan, G. [1 ]
机构：
[1] Gandhigram Rural Inst Deemed Univ, Dept Phys, Gandhigram 624302, Dindigul, India
来源：
DAE SOLID STATE PHYSICS SYMPOSIUM 2019 | 2020年 / 2265卷
关键词：
D O I：
10.1063/5.0016886
中图分类号：
O469 [凝聚态物理学];
学科分类号：
070205 ;
摘要：
Mixed metal sulphides are the latest trend in electrode materials. They deliver a superior electrochemical performance compared to the individual components. Copper incorporated nickel sulphide nanostructures were synthesized for various molar ratios of copper and nickel via a simple one-step hydrothermal method. The structural, morphological and electrochemical performance of the samples were analyzed towards supercapacitor applications. The CNS2 sample achieved a high specific capacitance of 1101 F g(-1) at a specific current of 5 A g(-1) with an extremely small charge transfer resistance of 3 Omega. The remarkable electrochemical results of CNS2 indicate it to be a suitable candidate for supercapacitor applications.
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页数：4
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