Multi-Chips High-Speed and High-Voltage Amplifier

被引：0
|
作者：
Li, Wen [1 ]
Makuuchi, Masami [2 ]
Chujo, Norio [1 ]
机构：
[1] Hitachi Ltd, Res & Dev Grp, Ctr Technol Innovat Prod Engn, Yokohama, Kanagawa, Japan
[2] Hitachi High Tech Corp, Hitachinaka, Ibaraki, Japan
来源：
2021 IEEE ASIA PACIFIC CONFERENCE ON CIRCUITS AND SYSTEMS (APCCAS 2021) & 2021 IEEE CONFERENCE ON POSTGRADUATE RESEARCH IN MICROELECTRONICS AND ELECTRONICS (PRIMEASIA 2021) | 2021年
关键词：
multi-chips amplifier; hybrid amplifying circuit; high-voltage; high-speed; withstand voltage; substrate voltage; divided chips;
D O I：
10.1109/APCCAS51387.2021.9687625
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
A linear amplifying circuit with high voltage, high slew rate and wide bandwidth is presented in this paper. The circuit is composed of three chips with different substrate voltage. The maximum output voltage swing can achieve almost twice the withstand voltage. The circuit is verified with a 0.25-um SOI-LDMOS technology with 200V withstand voltage. The experimental result shows that the output voltage swing is 425 Vpp with the slew rate of 1120 V/mu sec and bandwidth of 2.3 MHz. The multi-chips amplifier is expected to be used for many industrial applications.
引用
收藏
页码：201 / 204
页数：4
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