Embedded transmission line MMIC 1-W flip chip assembly using a Z-axis interconnect

被引：1

作者：

Budka, T ^{[1
]}

Ketterson, A ^{[1
]}

Tserng, HQ ^{[1
]}

Stiborek, L ^{[1
]}

Heinrich, L ^{[1
]}

Smith, R ^{[1
]}

Ables, B ^{[1
]}

Kyhl, C ^{[1
]}

Worthen, K ^{[1
]}

Brehm, G ^{[1
]}

Reddick, J ^{[1
]}

机构：

[1] Raytheon TI Syst, Dallas, TX 75265 USA

来源：

IEEE MICROWAVE AND GUIDED WAVE LETTERS | 1998年 / 8卷 / 06期

关键词：

embedded transmission line; flip chip; interconnect; microwave integrated circuits; power EET amplifier;

D O I：

10.1109/75.678578

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This letter describes a new type of electronic packaging topology using embedded transmission-line (ETL) monolithic microwave integrated circuits (MMIC's) along with a new state-of-the-art Z-axis material that acts as a chip adhesive as well as an electrical connection with a carrier substrate. The results from the first two flip chip assemblies that were produced under the Microwave Analog Front End Technology (MAFET) Thrust 2 Program are presented, The flip chip packages provided greater than 1-W package output power on a Kovar housing floor with greater than 8-dB package large signal gain at 11.5 GHz.

引用

页码：238 / 240

页数：3

共 3 条

[1] A flip-chip MMIC design with coplanar waveguide transmission line in the W-band
Hirose, T
Makiyama, K
Ono, K
Shimura, TM
Aoki, S
Ohashi, Y
Yokokawa, S
Watanabe, Y
[J]. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1998, 46 (12) : 2276 - 2282
[2] 2W Ku-band coplanar MMIC HPA using HBT for flip-chip assembly
Fraysse, JP
Vendier, O
Soulard, M
Auxemery, P
[J]. 2002 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3, 2002, : 441 - 444
[3] A new flip-chip MMIC technology with multi-layer transmission line structure for low-cost W-band transceivers
Masuda, S
Hirose, T
Yokokawa, S
Nishi, M
Iijima, S
Ono, K
Watanabe, Y
[J]. GAAS IC SYMPOSIUM, TECHNICAL DIGEST 2001, 2001, : 118 - 121

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