A pyrolysis-based technology for recovering useful materials from IC package molding resin waste

被引：5
|
作者：
Ikuta, Y [1 ]
Iji, M [1 ]
Ayukawa, D [1 ]
Shibano, S [1 ]
机构：
[1] NEC CORP LTD,ECOL BASED SYST RES LAB,RESOURCES & ENVIRONM PROTECT RES LABS,MIYAMAE KU,KAWASAKI,KANAGAWA 216,JAPAN
来源：
PROCEEDINGS OF THE 1996 IEEE INTERNATIONAL SYMPOSIUM ON ELECTRONICS AND THE ENVIRONMENT, CONFERENCE RECORD | 1996年
关键词：
D O I：
10.1109/ISEE.1996.500410
中图分类号：
X [环境科学、安全科学];
学科分类号：
08 ; 0830 ;
摘要：
引用
收藏
页码：124 / 129
页数：2
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