Crack initiation strength of an interface between a submicron-thick film and a substrate

被引:1
|
作者
Do Van Truong [1 ]
Kitamura, Takayuki [1 ]
Vuong Van Thanh [2 ]
机构
[1] Kyoto Univ, Dept Engn Sci & Mech, Kyoto 6068501, Japan
[2] Hanoi Univ Technol, Dept Design Machinery & Robot, Hanoi, Vietnam
来源
MATERIALS & DESIGN | 2010年 / 31卷 / 03期
关键词
Fracture; Bonding; Film and sheet; FREE-EDGE; ELASTIC WEDGES; STRESS; SIMULATIONS; NUCLEATION; PLASTICITY; GROWTH; STRAIN;
D O I
10.1016/j.matdes.2009.08.033
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The focus of this study was to evaluate the fracture initiation criteria of the interface between a thin film and a substrate by Bogy's, Kitamura's and Griffth's methods. The critical stress intensity parameter K(ijC) in Bogy's method and the concentrated stress parameter sigma(ijC) in Kitamura's method were calculated based on the singular stress field near the interface edge. The work of separation per unit area Gamma(o), in Griffth's method was calculated based on the work of fracture process. The results obtained show that in comparison among interface strengths, the fracture toughness K(00C) and the concentrated stress parameter sigma(00C) were respectively applied to material combinations with specific edge geometry and with weak stress singularity, while the work of separation per unit area Gamma(o), was applied in all cases. (C) 2009 Elsevier Ltd. All rights reserved.
引用
收藏
页码:1450 / 1456
页数:7
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