TCAD-based statistical modeling methodology for nanoscale FinFET variability

被引:0
|
作者
Guo, Ao [1 ]
Shang, Enming [1 ]
Hu, Shaojian [1 ]
Chen, Shoumian [1 ]
机构
[1] Shanghai IC Res & Dev Ctr, 497 Gaosi Rd,Zhangjiang Hitech Pk, Shanghai 201210, Peoples R China
关键词
compact model; fin-shaped field-effect transistor; process variation; static random access memory; statistical variability; WORK FUNCTION VARIATION;
D O I
10.1002/mop.32217
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We demonstrated in this article a TCAD-based (TCAD is defined as Technology Computer Aided Design) statistical modeling methodology for FinFET devices, which included TCAD Monte Carlo simulation, SPICE model library buildup, and model verification in circuit level. As a demonstrative example, a set of 14 nm FinFET devices are investigated for TCAD variability simulation and statistical model development. The stability and variability of different SRAM cells are further evaluated to verify the applicability of proposed statistical modeling methodology. The demonstrative statistical modeling method in this article is fully compatible with industrial standard methodology of CMOS device model, which can be easily immigrated into advanced technologies.
引用
收藏
页码:2097 / 2102
页数:6
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