Numerical modeling of EMC problems using the TLM method

被引：0
|
作者：
Vahldieck, R [1 ]
机构：
[1] ETH Zurich, Inst Electromagnet Fields & Micowave Elect IFH, CH-8092 Zurich, Switzerland
来源：
ELECTROMAGNETIC COMPATIBILITY 1999 SUPPLEMENT - TUTORIAL LECTURES, WORKSHOPS, OPEN MEETINGS AND ADVERTISEMENTS | 1999年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：49 / 56
页数：8
相关论文
共 50 条
  • [1] Modelling of EMC problems using TLM method.
    Piccolo, A
    Galdi, V
    Acone, M
    Amendolara, A
    EMC 2005: IEEE International Symposium on Electromagnetic Compatibility, Vols 1-3, Proceedings, 2005, : 432 - 437
  • [2] An Extended Hybrid Method for the Numerical Modeling of EMC Problems
    Balling, Stefan
    Plettemeier, Dirk
    Gonschorek, Karl-Heinz
    IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2010, 52 (03) : 604 - 611
  • [3] Applications of TLM to EMC problems
    Christopoulos, C
    Russer, P
    APPLIED COMPUTATIONAL ELECTROMAGNETICS: STATE OF THE ART AND FUTURE TRENDS, 2000, 171 : 324 - 350
  • [4] Application of the Transmission Line Matrix (TLM) Method to EMC Problems
    Russer, Peter
    Russer, Johannes A.
    2012 ASIA-PACIFIC INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (APEMC), 2012, : 141 - 144
  • [5] A combination of integral equation method and FD/TLM method for efficient solution of EMC problems
    Pierantoni, L
    Lindenmeier, S
    Russer, P
    27TH EUROPEAN MICROWAVE 97, CONFERENCE + EXHIBITION - BRIDGING THE GAP BETWEEN INDUSTRY AND ACADEMIA, VOLS I AND II, 1997, : 937 - 942
  • [6] Advanced simulation techniques in EMC based on the TLM method
    Christopoulos, C
    ELECTROMAGNETICS, 1996, 16 (05) : 567 - 590
  • [7] RECURSIVE METHOD FOR MODELING METALLIC BOUNDARIES USING TLM METHOD
    CACOVEANU, R
    SAGUET, P
    CIOCHINA, S
    HOMENTCOVSCHI, D
    ELECTRONICS LETTERS, 1995, 31 (15) : 1266 - 1267
  • [8] Finite integration technique numerical modeling for EMC and signal integrity problems
    Caniggia, S
    Leroux, E
    Orlandi, A
    Sassi, L
    ISIE 2002: PROCEEDINGS OF THE 2002 IEEE INTERNATIONAL SYMPOSIUM ON INDUSTRIAL ELECTRONICS, VOLS 1-4, 2002, : 1404 - 1409
  • [9] Analysis of TLM Air-vent Model Applicability to EMC Problems
    Nesic, Natasa J.
    Doncov, Nebojsa S.
    2015 23RD TELECOMMUNICATIONS FORUM TELFOR (TELFOR), 2015, : 579 - 582
  • [10] Modeling complex crack problems using the numerical manifold method
    Ma, G. W.
    An, X. M.
    Zhang, H. H.
    Li, L. X.
    INTERNATIONAL JOURNAL OF FRACTURE, 2009, 156 (01) : 21 - 35
12345