Laser shock cleaning

被引：0
|
作者：
Lee, JM [1 ]
Watkins, KG [1 ]
Steen, WM [1 ]
机构：
[1] Univ Liverpool, Dept Engn, Laser Grp, Liverpool L69 3GH, Merseyside, England
来源：
ICALEO(R) 2000: PROCEEDINGS OF THE LASER MATERIALS PROCESSING CONFERENCE, VOL 89 | 2000年 / 89卷
关键词：
D O I：
暂无
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
A new type of laser processing called "laser shock cleaning" in which the removal of the small particles is carried out by shock waves produced by laser sparking in air, is reported. The removal of very small metal particles (less than 1 mum in diameter) from silicon wafer surfaces was demonstrated successfully by this new technique. The process can be understood by investigation of the ablation phenomena and its cleaning mechanism can also be described by considering both the adhesion force of a particle on a surface and the shock pressure force produced by laser irradiation induced air breakdown.
引用
收藏
页码：D171 / D177
页数：7
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