Thermal effect analysis on crosstalk and performance of optoelectronic transmitter modules for optical interconnects

This paper presents thermal analysis on crosstalk and performance of optoelectronic transmitter modules and also demonstrates the thermal analysis for efficient heat dissipation for the transmitter modules. The thermal crosstalk model for analysis is based on interconnects parameters for vertically stacked and horizontally packaged optoelectronic transmitter modules. While the analytical expression is used to estimate the thermal critical frequency, fcrit_th, above which signals become severely deteriorated, a fcrit_thermal printed circuit board (PCB) has been designed for packaging the optoelectronic transmitter modules to ensure efficient heat dissipation. The thermal and performance analysis of the packaged modules show that the chips operate at temperatures below the fcrit_th, which is apt for reliable data and signal transmission.