High-Fidelity, High-Performance Computational Algorithms for Intrasystem Electromagnetic Interference Analysis of IC and Electronics

被引：24

作者：

Peng, Zhen ^{[1
]}

Shao, Yang ^{[1
]}

Gao, Hong-Wei ^{[1
]}

Wang, Shu ^{[1
]}

Lin, Shen ^{[1
]}

机构：

[1] Univ New Mexico, Dept Elect & Comp Engn, Appl Electromagnet Grp, Albuquerque, NM 87131 USA

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2017年 / 7卷 / 05期

基金：

美国国家科学基金会;

关键词：

Domain decomposition (DD) method; electromagnetic interference (EMI); integrated circuit (IC); signal integrity (SI); NONOVERLAPPING DOMAIN DECOMPOSITION; PACKAGE-ON-PACKAGE; SYSTEM-IN-PACKAGE; BOUNDARY INTEGRAL-EQUATIONS; REDUCED-ORDER MODELS; FAST DIRECT SOLVER; CHIP; SIMULATION; SCATTERING; EFFICIENT;

D O I：

10.1109/TCPMT.2016.2636296

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Ever-increasing complexity in high-speed electronic devices and systems presents significant computational challenges in the numerical analysis in terms of desired accuracy, efficiency, and scalable parallelism. The objective of this paper is to investigate high-resolution, high-performance full-wave field solvers for scalable electromagnetic simulations of product-level integrated circuits (ICs) and electronics. The emphasis is placed on advancing parallel algorithms that are provably scalable facilitating a design-through-analysis paradigm, and enabling concurrent multiscale modeling and computation. The capability and the benefits of the algorithms are validated and illustrated through complex 3-D IC and electronics applications.

引用

页码：653 / 668

页数：16

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