Single-wafer polysilicon engineering for the improvement of over erase in a 0.18-μm floating-gate flash memory

被引:5
|
作者
Luoh, T [1 ]
Han, TT [1 ]
Yang, YH [1 ]
Chen, KC [1 ]
Shih, HH [1 ]
Hwang, YL [1 ]
Hsueh, CC [1 ]
Chung, H [1 ]
Pan, S [1 ]
Lu, CY [1 ]
机构
[1] Macronix Int Corp Ltd, Si Lab, Adv Module Proc Dev, Hsinchu 300, Taiwan
关键词
flash memory; grain size; over erase; polysilicon; single-wafer;
D O I
10.1109/TSM.2003.810937
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A new polysilicon grain engineering technology for the improvement of over erase in 0.18-mum floating-gate flash memory has been developed with the use of single-wafer polysilicon processing, which makes it practical to use hydrogen as a process variable. The addition of hydrogen in polysilicon deposition significantly alters the reaction kinetics and produces polysilicon thin film of smooth surface, fine and uniformly distributed grains. Such a micrograin polysilicon possesses show excellent high-temperature stability. The benefits of the micrograin polysilicon are to be demonstrated through its improvement in over erase of a 0.18-mum floating-gate flash memory.
引用
收藏
页码:155 / 164
页数:10
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