Thermo-mechanical analysis and fatigue life prediction of MCM-D interconnects

被引：0
|
作者：
Larson, TW [1 ]
Newell, JM [1 ]
Cornford, SL [1 ]
机构：
[1] CALTECH,JET PROP LAB,PASADENA,CA
来源：
1966 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES, PROCEEDINGS | 1996年 / 2794卷
关键词：
MCM; analysis; thermo-mechanical; reliability; fatigue;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：317 / 322
页数：6
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