Three-dimensional memory module

Demand has recently increased for high packaging density and memory capacity of memory modules for electronic equipment, Our new three-dimensional memory (3-DM) module [1] satisfies this demand, This module has almost the same size as single memory packages [thin small outline packages (TSOPs): 17.4 x 9.22 x 1.2 mm] currently being used, and a package density four times as large, Electrical performance is better than that of TSOP's because the length of its wires is about half that of TSOP's wires, Moreover, the cost of fabrication this module is low, This paper reports the module's characteristics and fabrication process, The design concept is that nest-generation memory devices will be produced by using current mass produced memory devices.