Sample Preparation on Backside Mechanical Decapsulation Methodology for Effective Failure Analysis on Non-Exposed Die Pad Package

被引：0

作者：

Hoon, Ong Pei ^{[1
]}

Kay, Ng Kiong ^{[1
]}

Yen, Gwee Hoon ^{[1
]}

机构：

[1] Infineon Technol, Free Trade Zone, Batu Berendam 75350, Melaka, Malaysia

来源：

2018 25TH IEEE INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA) | 2018年

关键词：

backside analysis; backside mechanical decapsulation; non-exposed die pad package; intact copper lead;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Exposing the die backside is an important step in backside analysis. One of the most common techniques used is chemical preparation. However, the drawback of this technique for small non-exposed die pad package is that the copper lead will over etch by the 65% Acid Nitric Fuming if the device is not proper sealed with 3M High Temperature Tape. As a result, not able to proceed to further electrical measurements In view of this the mechanical decapsulation is an alternative solution to the existing procedure on the non-exposed die pad backside preparation. The end result of this technique is that the copper lead is intact and electrical measurement can be performed to improve the effectiveness and accuracy of physical failure analysis.

引用

页数：4