Highly manufacturable double-gate FinFET with gate-source/drain underlap

被引:2
|
作者
Yang, Ji-Woon [1 ]
Zeitzoff, Peter M. [1 ]
Tseng, Hsing-Huang [1 ]
机构
[1] SEMATECH Inc, CMOS Extens, Front End Proc Div, Austin, TX 78741 USA
关键词
CMOS field-effect transistors (CMOSFETs); double-gate MOSFET (DG MOSFET); gate source/drain (G-S/D) underlap; short-channel effects (SCEs); silicon-on-insulator technology;
D O I
10.1109/TED.2007.896387
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The speed performance of a double-gate (DG) FinFET CMOS with gate-source/drain (G-S/D) underlap is investieated using 2-D device and mixed-mode circuit simulation. By optimizing the G-S/D underlap, we demonstrate that the fin thickness of a DG FinFET can be significantly increased up to the physical gate length without degrading the speed performance compared to the conventional G-S/D overlap structure, where the fin thickness needs to be less than one-half of the physical gate length to control short-channel effects. Such an increase in fin thickness combined with a relaxed requirement for abruptness in the source/drain profile can dramatically enhance the manufacturability of DG FinFETs for the 32-nm technology node and beyond.
引用
收藏
页码:1464 / 1470
页数:7
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